Jestem przekonany ze spokonie >100$
"Thin disksofsilicon called “wafers” are used asthe raw material ofsemiconductor
manufacturing. Depending upon itscomposition, (for example, high-resistivity
silicon wafershave much greater electrical field depth -- and broader spectral
response -- than low-resistivitywafers) an 8" diameter wafer could costasmuch as
$450 to $500, $1,000 or even $5,000. After several hundred processsteps, perhaps
between 400 and 600 (including, for
example, thin film deposition,
lithography, photoresistcoating and
alignment, exposure, developing,
etching and cleaning), one hasa wafer
covered with sensors. Ifthe sensorsare
APS-Csize, thereareabout200 ofthem
on the wafer, depending on layoutand
the design ofthe peripheryofeach
sensor. For APS-H, there are about46
or so. Full-frame sensors? Just20. Consider, too, thatan 8" silicon
wafer usuallyyields1000 to 2000 LSI
(Large-Scale Integrated) circuits. If, say, 20 areashave defects, such asdustor
scratches, up to 1980 usable chipsremain. With 20 large sensorson a wafer, each
sensor isan easy“target.” Damage anywhere ruinsthe whole sensor. 20 randomly
distributed dustand scratch markscould ruin the whole batch. Thismeansthatthe
handling offull-frame sensorsduring manufacture needsto be obsessivelyprecise,
and therefore theyare more expensive.an 8-inch silicon wafercapable of yielding
thousandsof standard LSIs."
http://www.usa.canon.com/uploadedima...on_CMOS_WP.pdf